Chips Act
Articles
Chapter I General provisions
Chapter II Chips for Europe Initiative
- Article 3 — Establishment of the Initiative
- Article 4 — Objectives of the Initiative
- Article 5 — Content of the Initiative
- Article 6 — Synergies with Union programmes
- Article 7 — European chips infrastructure consortiums
- Article 8 — Liability of the ECIC
- Article 9 — Applicable law and jurisdiction of the ECIC
- Article 10 — Winding-up of the ECIC
- Article 11 — European network of competence centres in semiconductors
- Article 12 — Implementation
Chapter III Security of supply and resilience
- Article 13 — Integrated production facilities
- Article 14 — Open EU foundries
- Article 15 — Application for status as integrated production facility or open EU foundry
- Article 16 — Public interest and public support
- Article 17 — Design centres of excellence
- Article 18 — Fast-tracking of permit-granting procedures
Chapter IV Monitoring and crisis response
Section 1 Monitoring
- Article 19 — Strategic mapping of the Union’s semiconductor sector
- Article 20 — Monitoring and anticipation
- Article 21 — Key market actors
Section 2 Alerts and the activation of the crisis stage
Section 3 Shortage response
- Article 24 — Emergency toolbox
- Article 25 — Information gathering
- Article 26 — Priority-rated orders
- Article 27 — Common purchasing
Chapter V Governance
Section 1 European Semiconductor Board
- Article 28 — Establishment and tasks of the European Semiconductor Board
- Article 29 — Structure of the European Semiconductor Board
- Article 30 — Operation of the European Semiconductor Board
Section 2 National competent authorities
Chapter VI Confidentiality and penalties
- Article 32 — Treatment of confidential information
- Article 33 — Penalties
- Article 34 — Limitation period for the imposition of penalties
- Article 35 — Limitation period for the enforcement of penalties
- Article 36 — Right to be heard for the imposition of penalties